Enhanced Electronic System Reliability – Challenges for Temperature Prediction
نویسندگان
چکیده
Using telecommunication as an example, it is argued that the electronics industry badly needs a change in attitude towards reliability thinking. The role of thermal design and reliability qualification is discussed in context to current industrial needs for short design cycles and rapid implementation of new technologies. Current and future practices are discussed in the context of newly-emerging reliability standards. Finally, two multi-company projects targeting to improvement of reliability through better temperature-related information are described.
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